From the 15th until the 19th of February the first AdPack working meeting was held in Prague. The working mission started with the cluster visit on 16th in the Nanoprogres branch office and the consortium discussed the logo of AdPack and also the next deliverables, tasks and the next working mission in Malmö.
The 17th was related to the networking and dissemination event, which was held at the Technology Centre of the Academy of Sciences of the Czech Republic. In the first part of the event, the consortium members gave a presentation about their cluster and also a presentation of AdPack project. During the second half of the event, the consortium was informed about Czech National Cluster Association and about the Science and Technology Park of the Palacký University Olomouc. During the breaks, all consortium members got the opportunity to network with other participants. Among the participants have been representatives from Ministry of Industry and Trade, CzechInvest, cluster managers of CzechBio and Hi-tech Innovation Cluster of Pardubice and Technology Centre of the Academy of Sciences of the Czech Republic. The event was a good opportunity to talk about possible cooperation with other cluster members and also with the Czech National Cluster Association.
On the last working mission day, the consortium travelled to Brno to visit the EMBAX packaging fair which was held in conjunction with the Salima Food fair. The consortium visited all EMBAX booth and talked to many exhibitors. EMBAX is an international fair for packaging and in fact, there have been some foreign exhibitors but most have been from Czech Republic. Unfortunately, there were no real smart or advanced packaging solutions presented to the target audience. Therefore, the consortium believe that neither the Czech food industry is not aware of the advantages of smart packaging, nor the Czech packaging industry is investing in innovation in that field. The consortium will use the opportunity to disseminate project results in Czech Republic. Furthermore, the project could be a good starting point for the development of smart packaging solutions in the Czech Republic.
The next working mission will be held from the 17th – 21st October 2016 in Malmö, Sweden in conjunction with the Packbridge Top Packaging Summit.